Deoxybenzoin-based epoxy resins

The diepoxide of bishydroxydeoxybenzoin, termed BEDB, was prepared and used as a diepoxide in adhesive formulations with various aromatic diamine cross-linkers. These novel epoxy resins were characterized and compared to the properties of bisphenol A (BPA)- and 3,3′,5,5′-tetrabromobisphenol A (TBBA)-based epoxies in terms of their thermal and mechanical properties. Cured formulations were characterized to determine glass transition temperatures by differential scanning calorimetry (DSC). The char residue, heat release capacity, dynamic mechanical properties, fracture toughness, and adhesion strength of the cured resins were investigated by thermogravimetric analysis (TGA), microscale combustion calorimetry, dynamic mechanical analysis (DMA), plain-strain fracture toughness tests, and lap shear tests. The BEDB-based resins exhibited significantly higher fracture toughness and adhesion strength compared to the BPA-epoxy resins, as well as low heat release properties (i.e., lower flammability) despite the absence of halogen.