Title of article :
Adsorption of chain molecules into a thin film structure and solvation interaction versus molecular flexibility
Author/Authors :
Duda، نويسنده , , Yurko and Ochoa، نويسنده , , Francisco Lara and Trokhymchuk1، نويسنده , , Andrij، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2000
Abstract :
The influence of molecular flexibility on the properties of thin fluid films formed by linear chain molecules is studied by means of a singlet level of inhomogeneous integral equation theory. The considered m-mer chain molecules are formed through the polymerization of m hard-sphere beads with two sticky bonds randomly placed inside each bead core. Different molecular flexibility, from totally flexible up to almost completely rigid is reached by varying the interbead bonding length. The homogeneous properties of the same model that is necessary input to the singlet approach are extracted from the Wertheim’s theory of polymerization. The adsorption, local density distribution, disjoining pressure and solvation force of the chain molecule films confined by attractive and repulsive surfaces are analyzed. The obtained results indicate significant influence of the molecular flexibility on the film layering that is the origin of oscillations of solvation interaction arising between film surfaces. The oscillations of solvation pressure and force become more pronounced with restriction of molecular flexibility and with increase of bulk volume fraction of chain molecules. The decay of the oscillations across the film depends on the chain length and on the physical nature of the film surfaces, i.e. whether they are lyophilic or lyophobic. The partitioning of chain molecules from the bulk into the film strongly depends on the chain flexibility and this effect is more pronounced for the lyophilic surfaces.
Keywords :
Chain molecules , Flexibility , integral equations , Film
Journal title :
Colloids and Surfaces A Physicochemical and Engineering Aspects
Journal title :
Colloids and Surfaces A Physicochemical and Engineering Aspects