Growth manipulation in electrodeposition with self-assembled monolayers

A novel approach for manipulating the morphology and growth mode of metal electrodeposits based on the controlled modification of the electrode surface by self-assembled monolayers is introduced. Au(111) electrodes have been modified with alkanethiols of varying chain length and the electrodeposition of copper overlayers has been monitored by in situ electrochemical scanning tunneling microscopy. Through systematic control of the electrode potential and thiol chain length we can deposit two-dimensional copper clusters, three-dimensional copper nodules or grow smooth copper layers.