Title of article :
Effects of titanium addition on the microstructure of carbon/copper composite materials
Author/Authors :
Oku، نويسنده , , Takeo and Oku، نويسنده , , Tatsuo، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2007
Pages :
4
From page :
132
To page :
135
Abstract :
Carbon(C)/copper(Cu)-based materials with high thermal conductivity and good stability at high temperatures were developed by adding a small amount of titanium, which has a low enthalpy of alloy formation with C and Cu. The isotropic fine-grained nuclear grade graphite and felt type C/C composite, which were impregnated by Cu and titanium, provided 1.3 times higher thermal conductivity at 1200 K than the original carbon materials. Microstructural analysis showed that the increase of thermal conductivity is due to the formation of titanium compounds at the C/Cu interface. These carbon-based materials could be a candidate material for the plasma facing components of fusion devices.
Keywords :
A. Carbon , A. Composites , C. Thermal conductivity , C. Electron microscopy
Journal title :
Solid State Communications
Serial Year :
2007
Journal title :
Solid State Communications
Record number :
1791201
Link To Document :
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