Author/Authors :
Kim، نويسنده , , J.Y. and Ahn، نويسنده , , K. and Jeong، نويسنده , , S.Y. and Jeong، نويسنده , , E.D. and Jin، نويسنده , , J.S. and Bae، نويسنده , , J.S. and Kim، نويسنده , , H.G. and Cho، نويسنده , , C.R.، نويسنده ,
Abstract :
In this paper, we introduce methods which can effectively enhance the adhesion between polyphenylene sulfide (PPS) and bulk Cu. One of the methods involved the thermal evaporation of PPS to form a buffer layer on Cu and the other involved plasma treatment with reactive gases such as O2, H2, and N2 on the PPS buffer layer. The adhesion strength of samples prepared by PPS thin film coating (∼26 MPa) was largely enhanced when compared to that of samples obtained by only etching (∼15 MPa). Among the samples obtained by plasma treatment using various reactive gases, the samples treated using H2 plasma showed the best adhesion strength (of ∼32 MPa) in comparison to the other samples owing to the adhesion between hydrophobic surfaces.
