Title of article :
On the Langmuir–Blodgett transfer of copper tetra-tert-butyl phthalocyanine monolayers in the presence of arachidic acid
Author/Authors :
Sheu، نويسنده , , Ching-Wen and Lin، نويسنده , , Kuen-Mo and Ku، نويسنده , , I-Hsun and Chang، نويسنده , , Chien-Hsiang and Lee، نويسنده , , Yuh-Lang and Yang، نويسنده , , Yu-Min and Maa، نويسنده , , Jer-Ru Maa، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2002
Abstract :
This study investigated the influence of arachidic acid as a transfer promoter on the deposition of multilayer copper tetra-tert-butyl phthalocyanine (CuTTBPc) Langmuir–Blodgett (L–B) films on both hydrophilic glass and hydrophobic silanized-glass substrates. With the addition of arachidic acid in a CuTTBPc monolayer at the air/water interface, two transitions corresponding to monolayer collapse were observed in the surface pressure–area isotherm. However, the added arachidic acid had no effect on area relaxation of a CuTTBPc monolayer at 20 mN m−1. The up-stroke L–B transfer of a CuTTBPc monolayer at 20 mN m−1 onto a glass substrate was perfect with a transfer ratio of 1.0, but most of the deposited film respread onto the interface during the following down-stroke deposition. It appears that the addition of arachidic acid with a molar fraction of 0.5 caused insignificant influence on the continuous L–B deposition of CuTTBPc films on glass substrates. On a silanized-glass substrate, imperfect Y-type multilayer CuTTBPc L–B films could be fabricated with transfer ratios around 0.5. The presence of arachidic acid in a CuTTBPc monolayer may considerably improve the down-stroke first layer deposition with a transfer ratio close to one. Moreover, the following up-stroke deposition quality of the L–B films was strongly affected by the molar fraction of arachidic acid.
Keywords :
Monolayer , Transfer promoter , Phthalocyanine , Langmuir–Blodgett film
Journal title :
Colloids and Surfaces A Physicochemical and Engineering Aspects
Journal title :
Colloids and Surfaces A Physicochemical and Engineering Aspects