Title of article :
Microstructure and oxidation kinetics of intermetallic TiAl after Si- and Mo- ion implantation
Author/Authors :
U. HORNAUER†، نويسنده , , U and Richter، نويسنده , , E and Matz، نويسنده , , W and Reuther، نويسنده , , H and Mücklich، نويسنده , , A and Wieser، نويسنده , , E and Mِller، نويسنده , , W and Schumacher، نويسنده , , G and Schütze، نويسنده , , M، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2000
Pages :
5
From page :
418
To page :
422
Abstract :
Titanium aluminide alloys based on γ-TiAl have a substantial potential for high-temperature applications. However, there are still problems concerning the high-temperature oxidation behavior. Ion implantation is a promising tool for improving the oxidation resistance without disturbing the mechanical properties. A systematic investigation of the microstructure and phase development of silicon- and molybdenum-implanted γ-TiAl is presented. For Si, the fluence is varied from 2.5×1016 to 8×1017 cm−2 at an implantation energy of 1 MeV resulting in a local concentration of Si between 1 and 35 at.% at a projected range of 1 μm, measured by AES depth profiling. Grazing incidence XRD and transmission electron microscopy show the formation of a buried Ti5Si3 enriched layer at 650°C, which acts as a diffusion barrier for oxygen. Long-term TGA oxidation tests at 900°C in air show a positive effect in the beginning of oxidation for the fluence of 8×1017 Si cm−2. After a few hours the oxidation kinetics is similar to unimplanted Ti50Al, but the mass gain after 100 h is still 30% smaller. The influence of the local Si concentration on the oxidation behavior is discussed. Implantation of Mo at 180 keV (2×1016 and 1×1017 cm−2) has only a minor influence on the oxidation at 900°C. After implantation, Mo precipitates are found for the high fluence.
Keywords :
Silicon , Implantation , TiAl , Molybdenum , Oxidation
Journal title :
Surface and Coatings Technology
Serial Year :
2000
Journal title :
Surface and Coatings Technology
Record number :
1799637
Link To Document :
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