Title of article
Plasma treatment for fluxless soldering
Author/Authors
M. and Deltschew، نويسنده , , R. and Hirsch، نويسنده , , D. and Neumann، نويسنده , , H. and Herzog، نويسنده , , T. P. Wolter، نويسنده , , K.J. and Nowottnick، نويسنده , , M. and Wittke، نويسنده , , K.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2001
Pages
5
From page
803
To page
807
Abstract
Plasma treatment of printed circuit boards (PCB) with solid solder deposits (SSD) makes it possible to eliminate the application of conventional flux in reflow soldering process. This work deals with the dependence of surface modification of eutectic SnPb solder materials on gas pressure and gas flowrate of the CF4/air (10:1) gas mixture in the reactor. After plasma treatment, both metal fluoride and polymer formation is detected. The correlation between gas pressure and gas flowrate determines a regime for intensive plasma polymerization.
Keywords
Plasma treatment , plasma polymerization , Fluxless soldering
Journal title
Surface and Coatings Technology
Serial Year
2001
Journal title
Surface and Coatings Technology
Record number
1802310
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