Author/Authors :
M. and Deltschew، نويسنده , , R. and Hirsch، نويسنده , , D. and Neumann، نويسنده , , H. and Herzog، نويسنده , , T. P. Wolter، نويسنده , , K.J. and Nowottnick، نويسنده , , M. and Wittke، نويسنده , , K.، نويسنده ,
Abstract :
Plasma treatment of printed circuit boards (PCB) with solid solder deposits (SSD) makes it possible to eliminate the application of conventional flux in reflow soldering process. This work deals with the dependence of surface modification of eutectic SnPb solder materials on gas pressure and gas flowrate of the CF4/air (10:1) gas mixture in the reactor. After plasma treatment, both metal fluoride and polymer formation is detected. The correlation between gas pressure and gas flowrate determines a regime for intensive plasma polymerization.
