Title of article :
An international round-robin experiment to evaluate the consistency of nanoindentation hardness measurements of thin films
Author/Authors :
Lee، نويسنده , , Kitty W and Chung، نويسنده , , Yip-Wah and Chan، نويسنده , , C.Y. and Bello، نويسنده , , I and Lee، نويسنده , , S.T and Karimi، نويسنده , , Ayatollah and Patscheider، نويسنده , , Joerg and Delplancke-Ogletree، نويسنده , , M.P. and Yang، نويسنده , , Dehua and Boyce، نويسنده , , Brad and Buchheit، نويسنده , , Thomas، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2003
Pages :
5
From page :
57
To page :
61
Abstract :
We conducted an international round-robin experiment to determine the consistency of nanoindentation hardness measurements of thin films among six different laboratories, using three different samples. These samples were chosen to present a challenge of indenting at small loads (μN range). They were: 250-nm-thick TiNx, 700-nm-thick TiC, and 500-nm-thick TiB2/TiC multilayer coatings (each layer being 3-nm thick), prepared at Northwestern University using magnetron sputtering on silicon (0 0 1) substrates. Each research team was free to use whatever nanoindentor and analysis methods at its disposal. This round-robin experiment demonstrates that for the hardness range of interest (15–35 GPa) and using well-documented procedures and analysis methods, the reported results from all laboratories are essentially the same, allowing for a statistical spread of approximately ±14%. For consistent hardness measurements, four precautions must be observed: (i) proper tip-area function calibration, (ii) using sharp indenters, (iii) performing nanoindentation measurements with minimal thermal drift and with drift correction, (iv) using smooth samples, and (v) measuring the full hardness–maximum penetration curve.
Keywords :
Nanoindentation hardness , Round-robin experiment , Magnetron sputtering
Journal title :
Surface and Coatings Technology
Serial Year :
2003
Journal title :
Surface and Coatings Technology
Record number :
1805415
Link To Document :
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