Microfabrication of electro- and electroless-deposition and its application in the electronic field

The recent topics of our researches concerned with the electrochemical fabrication process of highly functionalized metal thin films and minute structures are reviewed. We present three topics; the soft magnetic materials of Co alloys by electro- and electroless-plating, the micro-dot formation by Ni electroless deposition, and fabrication of barrier layer on SiO2 by electroless deposition for ULSI technology. The magnetic property of electrodeposited CoNiFe film was deteriorated by the co-deposition of a small amount of sulfur, whereas the carbon co-deposition improved resistivity of the film. The electroless soft magnetic materials were also proposed for future extremely high-density recording system. As the fine dot formation, the electroless deposition processes for producing fine metal structures were demonstrated. For advanced nano-scale patterning technology, an organic monolayer directly grafted to the Si surface was applied to a novel process of selective metal deposition. Another type of organic monolayer, a self-assembled monolayer of organosilane, was also utilized as an adhesive/catalytic layer for fabrication of a diffusion barrier layer on SiO2 for future ULSI technology.