Sticking probability of sputtered particles and collisions on rotating Ni–P substrates

We present a new method to arbitrarily control surface concentration from one alloyed target. Introduction of the high-speed movement of a substrate changed the primary sticking probability of sputtered particles and generated gas flow near surface. The induced momentum of argon atoms to the direction of the substrate increased the effective secondary sticking probability. The important factor to modify the surface concentration is the area of the sector, which controls the collision frequency near the surface.