Title of article :
Optimum substrate bias condition for TiN thin film deposition using an ECR sputter system
Author/Authors :
Sung، نويسنده , , Youl-Moon and Kim، نويسنده , , Hee-Je، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2003
Pages :
8
From page :
75
To page :
82
Abstract :
The plasma parameters and ion bombardment energy were quantitatively investigated to find the optimum condition and the correlation between the plasma conditions and film properties. The electron density (ne) of approximately 1017/m3 was obtained in the substrate region under the condition where gas pressure was 1 mTorr and both power of the microwave and RF source were 500 W, and the electron temperature (Te) and ion saturation current (I0) were in the range of 3–5 eV and 1–1.5 mA/cm2, respectively. High resistivity of TiN films above −50 V bias was attributed to the amorphization of TiN films by ion bombardment effect, which was confirmed by X-ray diffraction analysis. It was found that there was an optimum bias voltage for best-quality TiN film formation, which showed a strong correlation with the ion bombardment energy.
Keywords :
Ion Energy Distribution , Substrate bias voltage , TiN Film , RF plasma , ECR sputtering
Journal title :
Surface and Coatings Technology
Serial Year :
2003
Journal title :
Surface and Coatings Technology
Record number :
1805957
Link To Document :
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