Title of article :
Microstructure evaluation and strengthening mechanism of Ni–P–W alloy coatings
Author/Authors :
Wu، نويسنده , , F.B and Tien، نويسنده , , S.K. and Chen، نويسنده , , W.Y and Duh، نويسنده , , J.G، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2004
Pages :
5
From page :
312
To page :
316
Abstract :
Ni–P–W alloy coatings were deposited onto AISI420 steel substrates by both RF magnetron sputtering and electroless plating techniques. The coating hardness was investigated through the microhardness testing with a Knoop indenter. The strengthening mechanism of the Ni–P–W coatings in both as-deposited and heat-treated states were described with respect to compositional distribution and microstructural evolutions. In the as-deposited state, all the coatings exhibited amorphous/nanocrystalline structure. After heat treatment, the amorphous phase of Ni–P–W coatings transformed into Ni3P precipitates and Ni(W) solid solution. The coatings were strengthened by the precipitation of Ni–P compounds and dissolving of W in the crystallized Ni matrix. With the aid of microstructure, the strengthening mechanism for the Ni–P–W coatings were proposed. Quantitative analysis for the strengthening effect of the Ni–P–W coatings was performed based on the elemental concentrations, Ni–P compound precipitation and Ni(W) matrix ratio. The heat-treated Ni76.7P15.9W7.4 coating showed the highest peak hardness of 17.5 GPa when the maximum W solution in the Ni matrix was achieved.
Keywords :
Ni–P-based ternary coating , Microhardness , RF magnetron sputtering , strengthening , Electroless Plating
Journal title :
Surface and Coatings Technology
Serial Year :
2004
Journal title :
Surface and Coatings Technology
Record number :
1807144
Link To Document :
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