Author/Authors :
Jankov، نويسنده , , I.R. and Szente، نويسنده , , R.N. and Goldman، نويسنده , , I.D. and Carreٌo، نويسنده , , M.N.P. and Valle، نويسنده , , M.A. and Behar، نويسنده , , M. and Costa، نويسنده , , C.A.R. and Galembeck، نويسنده , , F. and Landers، نويسنده , , R.، نويسنده ,
Abstract :
As part of the studies of new materials to be used as electrodes for plasma torches, polycrystalline copper thin film substrates, obtained by depositing copper on silicon wafer using the Electron Beam technique, were implanted with low energy (20–50 keV) alkali ions. The samples, before and after implantation process, were analysed in terms of surface composition and work function changes. Although the implantation doses were low (3×1015 ions/cm2), relatively high concentrations of alkali metals were detected on the surface, which yielded a work function decrease of 3–9% in relation to the copper value.
