Two-dimensional texture and sheath evolution in metal plasma immersion ion implantation

The spatial texture evolution and variation across a sample holder (6 cm diameter) was investigated for titanium nitride thin films deposited by metal plasma immersion ion implantation and deposition (MePIIID). With increasing pulse voltage from −1 to −10 kV and increasing pulse frequency, a transition of the texture from [111] via [220] to [200] was observed. Here, the product of pulse frequency and voltage is determining the texture, with the slight dependence of the fluence per pulse on the voltage as a minor correction. Near the edge of the samples, a tilt of the crystallites was observed. For high frequencies, an equilibrium position was observed, while a gradual decrease of the tilt with lower frequencies is present. Apparently, the orientation of the grains along the ion incidence direction is a dynamic process requiring a certain minimum energy input for a complete transformation.