Author/Authors :
Zamanzad-Ghavidel، M. R. نويسنده Department of Materials Engineering, Isfahan University of Technology, Isfahan 84156-83111, Iran. , , Raeissi، K. نويسنده Department of Materials Engineering, Isfahan University of Technology, Isfahan, Iran. , , Saatchi، A. نويسنده Department of Materials Engineering, Isfahan University of Technology, Isfahan 84156-83111, Iran Saatchi, A.
Abstract :
Nickel was electrodeposited onto copper substrates with high {111} and {400} peak intensities. The grain
size of coatings deposited onto the copper substrate with a higher {111} peak intensity was finer. Spheroidized pyramid
morphology was obtained at low current densities on both copper substrates. By increasing the deposition current
density, grain size of the coating was increased for both substrates and eventually a mixed morphology of pyramids
and blocks was appeared without further increase in grain size. This decreased the anodic exchange current density
probably due to the decrease of surface roughness and led to a lower corrosion rate.
