Process stabilization and enhancement of deposition rate during reactive high power pulsed magnetron sputtering of zirconium oxide

Reactive high power pulsed magnetron sputtering (HPPMS) of zirconium oxide exhibits a stable and hysteresis-free transition zone, as opposed to reactive direct current magnetron sputtering (dcMS). The stabilization of the transition zone in HPPMS facilitates the growth of transparent zirconium oxide films at lower target coverage, in comparison to dcMS. The lower target coverage, in turn, allows for film deposition rates up to 2 times higher than those achieved by dcMS. The mechanisms which lead to the process stabilization in reactive HPPMS are discussed.