Title of article :
Deposition of thick TiAlN coatings on 2024 Al/SiCp substrate by Arc ion plating
Author/Authors :
Zhao، نويسنده , , Sheng-Sheng and Du، نويسنده , , Hao and Zheng، نويسنده , , Jing-Di and Yang، نويسنده , , Ying and Wang، نويسنده , , Wei and Gong، نويسنده , , Jun and Sun، نويسنده , , Chao، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2008
Abstract :
Aluminum-matrix composites with particulate SiC ceramic reinforcements (Al/SiCp) have received much attention for space and aircraft propulsion applications. It is imperative to deposit thick hard coatings on these composites for protection. TiAlN coatings with a Ti interlayer were deposited by arc ion plating (AIP) on 2024 Al/SiCp substrates at various nitrogen flow rates. It was found that when the nitrogen flow rate is increased from 100 sccm to 250 sccm, the deposition rate decreases, the coating hardness increases and the adhesion strength decreases. Based on the above results and the principle of gradient materials, the thick gradient TiAlN coatings with a Ti interlayer were successfully deposited on a 2024 Al/SiCp substrate to a thickness of 60 μm by continuously increasing the nitrogen flow rate during deposition. Such an achievement can be attributed to the gradient distribution of elements, hardness, and stresses across the coating thickness.
Keywords :
arc ion plating , Gradient TiAlN coating , Al/SiCp substrate , Nitrogen flow rate
Journal title :
Surface and Coatings Technology
Journal title :
Surface and Coatings Technology