Title of article
Preparation, microstructure and sliding-wear characteristics of brush plated copper–nickel multilayer films
Author/Authors
Qian، نويسنده , , Yaochuan and Tan، نويسنده , , Jun and Liu، نويسنده , , Qingqing and Yu، نويسنده , , Helong and Xing، نويسنده , , Ruxin and Yang، نويسنده , , Hongjun، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2011
Pages
7
From page
3909
To page
3915
Abstract
Cu/Ni multilayer films with sublayer thickness (h) ranging from 10 to 1000 nm were prepared on ANSI 1045 steel by brush plating of periodically changing layers of Cu and Ni. The microstructure, composition, microhardness and sliding wear properties against standard SiC ball under unlubricated condition were examined. It was found that the brush plated multilayer films are highly dense and free from porosity. A decrease in h results in smaller grain size and lower coefficient of friction. Both microhardness and wear resistance reach the maximum value when h = 20 nm. Although found with lower hardness compared with brush plated Ni monolayer coating, multilayer films with h ranging from 20 to 80 nm showed improved wear resistance. The increase in the wear resistance was attributed to the combined effect of strengthening of the layer structure and the lubricating of Cu.
Keywords
Cu/Ni multilayers , Brush plating , Electrodeposition , Friction and wear
Journal title
Surface and Coatings Technology
Serial Year
2011
Journal title
Surface and Coatings Technology
Record number
1824231
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