Grain resolved orientation changes and texture evolution in a thermally strained Al film on Si substrate

Temperature changes induce thermal stresses in thin films on substrates due to differences in the thermal expansion coefficients. Repeated thermal cycling may finally lead to severe surface roughening and a change in film texture. In this study we investigate the orientation changes for a 600 nm thick Al film during subsequent thermal cycles between 25 °C and 450 °C by analyzing individual grains. The results reveal orientation changes by up to 3° after one thermal cycles and unexpected large orientation gradients within individual grains.