Author/Authors :
Ivanov، نويسنده , , Yu.F. and Koval، نويسنده , , N.N. and Krysina، نويسنده , , O.V. and Baumbach، نويسنده , , T. and Doyle، نويسنده , , S. and Slobodsky، نويسنده , , T. V. Timchenko ، نويسنده , , N.A. and Galimov، نويسنده , , R.M. and Shmakov، نويسنده , , A.N.، نويسنده ,
Abstract :
Experimental data are presented on the structure and properties of hardening nanocrystalline copper-added titanium nitride coatings produced by plasma-assisted vacuum arc evaporation of sintered cathodes. A model of the nanostructurization of this type of coating is proposed. According to the model, the nanocrystallization in these materials is due to the added atoms, which form an amorphous sheath around a grain that restricts the grain growth.
Keywords :
Ti–Cu–N coating , X-ray diffraction , Transmission electron microscopy , Nanocrystalline structure , Vacuum-arc deposition
