Title of article :
Fabrication, characterization and applications of novel nanoheater structures
Author/Authors :
Gu، نويسنده , , Zhiyong and Cui، نويسنده , , Qingzhou and Chen، نويسنده , , Julie and Buckley، نويسنده , , Jacqueline and Ando، نويسنده , , Teiichi and Erdeniz، نويسنده , , Dinc and Wong، نويسنده , , Peter and Hadjiafxenti، نويسنده , , Anastasia and Epaminonda، نويسنده , , Panos and Gunduz، نويسنده , , Ibrahim Emre and Rebholz، نويسنده , , Claus and Doumanidis، نويسنده , , Charalabos C.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2013
Pages :
10
From page :
493
To page :
502
Abstract :
Nanoheaters are reactive nanostructures that can generate localized heat through controlled ignition. Besides the widely used nanofoil structure with multiple alternative Al–Ni layers, various new nanostructures have been fabricated in the last several years, including consolidated films, bimetallic nanoparticles and nanowires, and ball milled micro/nano powders. In this paper, we demonstrate the (1) Synthesis of Al–Ni bimetallic nanoparticles by a galvanic replacement reaction method using Al nanoparticle templates; (2) Fabrication of Al–Ni nanowire structures by a two-step process involving electrodeposition and thermal evaporation; (3) Fabrication of Al–Ni composites by a novel ultrasonic powder consolidation method, using Al and Ni nanoparticles as source materials and (4) Synthesis of nanostructured Al–Ni powders by low energy ball milling with microscale Al and Ni powders. The structure and compositions of the nanoheater structures have been characterized by scanning electron microscopy and transmission electron microscopy, energy dispersive X-ray spectroscopy, and X-ray diffraction. The thermal characteristics of the samples were studied using differential scanning calorimetry. These novel nanoheater structures have great potential to be used in micro-joining, microelectronics assembly, and flexible electronics bonding.
Keywords :
Reactive nanostructures , ball milling , Galvanic replacement reaction , Micro-joining , Electronics assembly , Ultrasonic powder consolidation
Journal title :
Surface and Coatings Technology
Serial Year :
2013
Journal title :
Surface and Coatings Technology
Record number :
1827145
Link To Document :
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