Title of article
Copper-catalyzed Ullmann coupling under ligand- and additive-free conditions. Part 2: S-Arylation of thiols with aryl iodides
Author/Authors
Shiya and Buranaprasertsuk، نويسنده , , Pongchart and Chang، نويسنده , , Joyce Wei Wei and Chavasiri، نويسنده , , Warinthorn and Chan، نويسنده , , Philip Wai Hong، نويسنده ,
Issue Information
هفته نامه با شماره پیاپی سال 2008
Pages
3
From page
2023
To page
2025
Abstract
S-Arylation of a wide variety of substituted aryl and aliphatic thiols with aryl halides catalyzed by copper iodide under mild ligand- and additive-free conditions (nBu4NBr, PhMe, NaOH, reflux, 22 h) is accomplished in good to excellent product yields (up to 96%).
Journal title
Tetrahedron Letters
Serial Year
2008
Journal title
Tetrahedron Letters
Record number
1858643
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