• Title of article

    Heat transfer enhancement in mini-channel heat sinks with dimples and cylindrical grooves

  • Author/Authors

    Bi، نويسنده , , C. and Tang، نويسنده , , G.H. and Tao، نويسنده , , W.Q.، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2013
  • Pages
    12
  • From page
    121
  • To page
    132
  • Abstract
    The convective cooling heat transfer in mini-channels with dimples, cylindrical grooves and low fins is numerically studied by using the field synergy principle. We solve the synergy angle distribution to examine the mechanisms of the heat transfer enhancement in the enhanced surfaces. The parameter PEC as the evaluation coefficient is employed to study the comprehensive performance of the enhanced surfaces. The results show that the dimple surface presents the highest performance of heat transfer enhancement. The geometry size effects of dimple are studied over a Reynolds number range of 2700–6100, and the most favorable dimple geometric structures are optimized by using the performance evaluation plot of enhanced heat transfer techniques.
  • Keywords
    Heat transfer enhancement , dimple , Cylindrical groove , Field synergy principle
  • Journal title
    Applied Thermal Engineering
  • Serial Year
    2013
  • Journal title
    Applied Thermal Engineering
  • Record number

    1905797