Title of article :
Detection of Cu(hfac)(tmvs) by Li+ ion attachment mass spectrometry
Author/Authors :
Fujii، نويسنده , , Toshihiro and Arulmozhiraja، نويسنده , , Sundaram and Nakamura، نويسنده , , Megumi and Shiokawa، نويسنده , , Yoshiro، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2006
Pages :
4
From page :
134
To page :
137
Abstract :
Li+ ion attachment mass spectrometry was used to detect Cu(1,1,1,5,5,5-hexafluoroacetylacetonate)(vinyltrimethylsilane) [Cu(hfac)(tmvs)], a thermally labile precursor used in copper chemical vapor deposition (Cu-CVD), with the intent of developing improved methods for mass-spectrometric analysis of the CVD process. A uniquely designed quadrupole mass spectrometry (QMS) system coupled with a Li+ ion emitter and a laboratory-built direct introduction system of the sample provided the molecular ion of Cu(hfac)(tmvs) as the Li+ ion adduct for the first time. The use of this system demonstrates the feasibility of generating Li+ ion adduct for real-time monitoring of products encountered in Cu-CVD process facilities.
Journal title :
Chemical Physics Letters
Serial Year :
2006
Journal title :
Chemical Physics Letters
Record number :
1919140
Link To Document :
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