• Title of article

    Detection of Cu(hfac)(tmvs) by Li+ ion attachment mass spectrometry

  • Author/Authors

    Fujii، نويسنده , , Toshihiro and Arulmozhiraja، نويسنده , , Sundaram and Nakamura، نويسنده , , Megumi and Shiokawa، نويسنده , , Yoshiro، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2006
  • Pages
    4
  • From page
    134
  • To page
    137
  • Abstract
    Li+ ion attachment mass spectrometry was used to detect Cu(1,1,1,5,5,5-hexafluoroacetylacetonate)(vinyltrimethylsilane) [Cu(hfac)(tmvs)], a thermally labile precursor used in copper chemical vapor deposition (Cu-CVD), with the intent of developing improved methods for mass-spectrometric analysis of the CVD process. A uniquely designed quadrupole mass spectrometry (QMS) system coupled with a Li+ ion emitter and a laboratory-built direct introduction system of the sample provided the molecular ion of Cu(hfac)(tmvs) as the Li+ ion adduct for the first time. The use of this system demonstrates the feasibility of generating Li+ ion adduct for real-time monitoring of products encountered in Cu-CVD process facilities.
  • Journal title
    Chemical Physics Letters
  • Serial Year
    2006
  • Journal title
    Chemical Physics Letters
  • Record number

    1919140