Ultrasonic-assisted fabrication of highly dispersed copper/multi-walled carbon nanotube nanowires

Highly dispersed copper/multi-walled carbon nanotube (MWCNT) nanowires have been fabricated using ultrasonic-assisted electroless copper plating. The structures of the Cu/MWCNT nanowires were characterized by transmission electron microscopy (TEM), scanning electron microscopy (SEM), X-ray diffraction (XRD) and energy-dispersive X-ray spectroscopy (EDX). The study clearly demonstrates the advantages of the ultrasonic technique on electroless copper plating on MWCNT, including an enhanced electroless copper deposition rate, improved interfacial bonding as well as preventing Cu/MWCNT nanowires from aggregating.