Title of article :
Effect of headgroups on the aggregation behavior of cationic silicone surfactants in aqueous solution
Author/Authors :
Tan، نويسنده , , Jinglin and Ma، نويسنده , , Depeng and Feng، نويسنده , , Shengyu and Zhang، نويسنده , , Changqiao، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2013
Abstract :
Three cationic silicone surfactants, 1-methyl-3-[tri-(trimethylsiloxy)]silylpropyl-imidazolium chloride (Si4mimCl), (2-hydroxyethyl)-N,N-dimethyl-3-[tri-(trimethylsiloxy)]silylpropylammonium chloride (Si4mam-OHCl), 1-methyl-1-[tri-(trimethylsiloxy)]silylpropylpyrrolidinium chloride (Si4pyCl), with the same hydrophobic group and different headgroups were synthesized. Their aggregation behavior in aqueous solution was systematically investigated by surface tension, electrical conductivity, and steady-state fluorescence. Surface tension of water can be reduced almost to 20 mN m−1 with the addition of the cationic silicone surfactants. This result indicates that all the three surfactants exhibit remarkable surface activity. Because of the effect of the headgroups, the critical micelle concentrations (CMC) values increase following the order Si4pyCl < Si4mimCl < Si4mam-OHCl, and Si4pyCl packs more tightly at the air/water interface compared with Si4mimCl and Si4mam-OHCl. Electrical conductivity measurements show that all the three cationic silicone surfactants have low degree of counterion binding (β) and the β values for Si4pyCl and Si4mam-OHCl increase with increasing the temperature in the investigated temperature range. Thermodynamic parameters ( Δ H m 0 , Δ S m 0 , and Δ G m 0 ) of micellization indicate that the micellization for Si4mimCl in aqueous is enthalpy-driven, and that for both the Si4pyCl and Si4mam-OHCl entropy-driven.
Keywords :
Entropy-driven , Enthalpy-driven , Degree of counterion binding , electrical conductivity , Cationic silicone surfactants
Journal title :
Colloids and Surfaces A Physicochemical and Engineering Aspects
Journal title :
Colloids and Surfaces A Physicochemical and Engineering Aspects