Author/Authors :
Yarema، نويسنده , , Raymond and Deptuch، نويسنده , , Grezgorz and Hoff، نويسنده , , Jim and Shenai، نويسنده , , Alpana and Trimpl، نويسنده , , Marcel and Zimmerman، نويسنده , , Tom and Demarteau، نويسنده , , Marcel and Lipton، نويسنده , , Ron and Christian، نويسنده , , Dave، نويسنده ,
Abstract :
Fermilab began exploring the technologies for vertically integrated circuits (also commonly known as 3D circuits) in 2006. These technologies include through silicon vias (TSV), circuit thinning, and bonding techniques to replace conventional bump bonds. Since then, the interest within the High Energy Physics community has grown considerably. This paper will present an overview of the activities at Fermilab over the last 3 years which have helped spark this interest.
