Simulating intrinsically AC-coupled hybrid pixel detectors

A bonding technique allowing AC-coupling of large hybrid pixel detectors in a simple and economic way is proposed. It consists in using a screen printing method to deposit non-conductive glue drops to interconnect diodes and VLSI cells. The AC-coupling can thus be achieved through the capacitance defined by the non-conductive glue drop realising the bonding itself. The feasibility of the proposed technique, together with its limitations, has been investigated by calculations and PSPICE simulations on a 5 × 5 pixel array.