Author/Authors :
Lanin، نويسنده , , V.L.، نويسنده ,
Abstract :
Ultrasonic (US) soldering of electronic components, as an alternative to flux soldering, is environmentally friendly, improves the quality of soldered connections at the mounting elements after long-term storage, and allows the use of lead-free solders. Methods of US solder melt activation, lead-free solders in US soldering and glass–ceramic capacitor metallization processes have been investigated.