Silicon-based HPD development: sensors and front ends

Developments of Si sensors and associated front-end electronics for use with Hybrid Photon Detectors (HPD) are reviewed. Si pixel sensors, dc-coupled Si pad sensors and ac-coupled Si pad sensors using double-metal technology are employed. Low noise front-end electronics with shaping times in the range, in the range of 100 ns to 2 μs is used for the readout. A fast front-end chip with LHC specifications has also been tested. Results on the performance of several prototype devices are reported.