• Title of article

    Current trends on design and assembly of pixel detector systems in biomedicine and high-energy physics

  • Author/Authors

    Caria، نويسنده , , M، نويسنده ,

  • Pages
    11
  • From page
    167
  • To page
    177
  • Abstract
    The design and assembly of an integrated system made of pixel sensors as sensitive elements combined with read-out electronics and connecting cables or alternative connecting structures, is discussed. The new trends are summarised and critically evaluated. It is shown that many problems are common to High-Energy Physics and Biomedical devices and that this cross-interaction is profitable. Technological choices on new highly integrated modules are presented, with the first successful cases and the risks of failure.
  • Keywords
    Bump bonding , VLSI read-out , Multi-chip modules , MCM , Pixel detectors
  • Journal title
    Astroparticle Physics
  • Record number

    2012227