Title of article
Multi-electrode CZT detector packaging using polymer flip chip bonding
Author/Authors
Jordanov، نويسنده , , Valentin T. and Macri، نويسنده , , John R. and Clayton، نويسنده , , James E. and Larson، نويسنده , , Kipp A.، نويسنده ,
Pages
7
From page
511
To page
517
Abstract
Polymer flip chip bonding has been used to package a multi-electrode CZT detector. During the packaging process the temperature of all components was kept less than 80°C. The size of the conductive epoxy eontacts is less than 120 μm in diameter. Thermal cycling, and random and structural vibration tests indicate reliable detector–substrate interconnection and rugged construction.
Keywords
Epoxy bonding , CZT detectors , Flip-Chip bonding , Detector packaging
Journal title
Astroparticle Physics
Record number
2013849
Link To Document