Pixel detector modules using MCM-D technology

For the upcoming ATLAS–Experiment at CERN it is planned to build a large area Pixel Detector, providing more than 100×106 sensor cells. For the innermost layer, the B–Physics layer, it is planned to use MCM–D technology to perform the signal interconnections and power distribution on the modules. Focus of this paper is to give an introduction to this technology and present measurements on single chip MCM–D assemblies and a full scale MCM–D module prototype.