Author/Authors :
Seller، نويسنده , , P. and Derbyshire، نويسنده , , G. and Hall، نويسنده , , G. and Iles، نويسنده , , G.M and Jorden، نويسنده , , A. and Murray، نويسنده , , P. and Prydderch، نويسنده , , M.L and Passmore، نويسنده , , S.M. and SMITH، نويسنده , , K. and Thomas، نويسنده , , S.L.، نويسنده ,
Abstract :
Modules of a photon counting pixelated silicon X-ray detector have been built and tested. The modules have a uniform pixel size of 150×150 μm over a silicon detector of 448×64 pixels. The detector is solder bump bonded to readout chips and then onto a molybdenum cooling substrate. Several modules have been built and images obtained with X-rays sources. The detectors work at 200 k photons per second per pixel giving a module counting rate of 6×109 photons per second. The modules are designed to be tiled to create larger arrays. The paper shows images obtained from the modules and describes a detector problem caused by adjacent pixels being shorted together.
Keywords :
Pixels detectors , x-ray imaging , Silicon , Spectroscopy , Bump-bonding , Photon counting
