Author/Authors :
Hansson، نويسنده , , P. and Balbuena، نويسنده , , J. and Barrera، نويسنده , , C. and Bolle، نويسنده , , E. and Borri، نويسنده , , M. and Boscardin، نويسنده , , M. and Chmeissan، نويسنده , , M. and Dalla Betta، نويسنده , , G.-F. and Darbo، نويسنده , , G. and Da Via، نويسنده , , C. and Devetak، نويسنده , , E. and DeWilde، نويسنده , , B. and Su، نويسنده , , D. and Dorholt، نويسنده , , O. and Fazio، نويسنده , , S. and Fleta، نويسنده , , C. and Gem، نويسنده ,
Abstract :
The 3D silicon sensors aimed for the ATLAS pixel detector upgrade have been tested with a high energy pion beam at the CERN SPS in 2009. Two types of sensor layouts were tested: full-3D assemblies fabricated in Stanford, where the electrodes penetrate the entire silicon wafer thickness, and modified-3D assemblies fabricated at FBK-irst with partially overlapping electrodes. In both cases three read-out electrodes are ganged together to form pixels of dimension 50 × 400 μ m 2 . Data on the pulse height distribution, tracking efficiency and resolution were collected for various particle incident angles, with and without a 1.6 T magnetic field. Data from a planar sensor of the type presently used in the ATLAS detector were used at the same time to give comparison.
Keywords :
SLHC , Silicon sensors , ATLAS upgrade , 3D sensors , Radiation detectors
