Title of article
Study of indium bumps for the ATLAS pixel detector
Author/Authors
Gemme، نويسنده , , C. and Fiorello، نويسنده , , A.M. and Gagliardi، نويسنده , , G. and Gilchriese، نويسنده , , M. and Netchaeva، نويسنده , , P. and Rossi، نويسنده , , L. and Ruscino، نويسنده , , E. and Vernocchi، نويسنده , , F. and Varasi، نويسنده , , M.، نويسنده ,
Pages
4
From page
200
To page
203
Abstract
The bump-bonding technology is used to join the front-end read-out chips to the silicon substrate of the ATLAS pixel detector. We review the current status of the technology used by Alenia Marconi Systems and we report on the electrical and mechanical properties and the defect rate of the Indium bumps.
Keywords
Bump bonding , Pixel detector
Journal title
Astroparticle Physics
Record number
2015978
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