Author/Authors :
Grenier، نويسنده , , P. and Alimonti، نويسنده , , G. and Barbero، نويسنده , , M. and Bates، نويسنده , , R. and Bolle، نويسنده , , E. and Borri، نويسنده , , M. and Boscardin، نويسنده , , M. and Buttar، نويسنده , , C. and Capua، نويسنده , , M. and Cavalli-Sforza، نويسنده , , M. and Cobal، نويسنده , , M. and Cristofoli، نويسنده , , A. and Dalla Betta، نويسنده , , G.-F. and Darbo، نويسنده , , G. and Da Via، نويسنده , , C. and Devetak، نويسنده ,
Abstract :
Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS inner detector solenoid field. Sensors were bump-bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.
Keywords :
ATLAS upgrade , Silicon sensors , 3D sensors , Radiation hard detectors
