Title of article
Characterization of indium and solder bump bonding for pixel detectors
Author/Authors
Cihangir، نويسنده , , S and Kwan، نويسنده , , S، نويسنده ,
Pages
6
From page
670
To page
675
Abstract
A review of different bump-bonding processes used for pixel detectors is given. A large-scale test on daisy-chained components from two vendors has been carried out at Fermilab to characterize the yield of these processes. The vendors are Advanced Interconnect Technology Ltd. (AIT) of Hong Kong and MCNC in North Carolina, USA. The results from this test are presented and technical challenges encountered are discussed.
Keywords
Fluxless soldering , Pixel detectors , Indium bumps , Fine pitch solder bumps
Journal title
Astroparticle Physics
Record number
2018187
Link To Document