Title of article
High-power comparison among brazed, clamped and electroformed X-band cavities
Author/Authors
Spataro، نويسنده , , B. and Alesini، نويسنده , , D. E. Chimenti، نويسنده , , V. and Dolgashev، نويسنده , , V. and Higashi، نويسنده , , Y. and Migliorati، نويسنده , , M. and Mostacci، نويسنده , , A. and Parodi، نويسنده , , R. and Tantawi، نويسنده , , S.G. and Yeremian، نويسنده , , A.D.، نويسنده ,
Pages
6
From page
88
To page
93
Abstract
We report the building procedure of X-band copper structures using the electroforming and electroplating techniques. These techniques allow the deposition of copper layers on a suitable die and they can be used to build RF structures avoiding the high temperature brazing step in the standard technique. We show the constructed prototypes and low power RF measurements and discuss the results of the high power tests at SLAC National Accelerator Laboratory.
Keywords
Arrays , Amplifiers , Rings , Electroplating , Particle acceleration , linear accelerator , Resonators , Cavities
Journal title
Astroparticle Physics
Record number
2018312
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