Multilayer thin-film technology enabling technology for solving high-density interconnect and assembly problems

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called “interconnect technology gap”. Multilayer thin-film technology is proposed as a “bridge”-technology between the very high-density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true “System-in-a-Package” solutions, combining multiple “System-on-a-Chip” ICs with other components and also integrating passive components in its layers.