Author/Authors :
Audley، نويسنده , , Michael D and Duncan، نويسنده , , William D and Holland، نويسنده , , Wayne S and Walton، نويسنده , , Anthony and Parkes، نويسنده , , William and Dunare، نويسنده , , Camelia and Gundlach، نويسنده , , Alan and Stevenson، نويسنده , , Tom and Irwin، نويسنده , , Kent D and Hilton، نويسنده , , Gene C and Schulte، نويسنده , , Eric and Ade، نويسنده , , Peter A.R and Tucker، نويسنده , , Carole، نويسنده ,
Abstract :
We describe the techniques used to fabricate SCUBA-2, the first large-format, filled array of bolometers for sub-millimeter astronomy. With two monolithic arrays of ∼10,000 bolometers, SCUBA-2 is made possible by a unique combination of advanced technologies. The detectors are made from thermally bonded and thinned silicon wafers whose surface is ion-implanted to match the impedance of free space. SCUBA-2s pixels are suspended on a 500 nm silicon nitride membrane with low tensile stress. Deep-etch micromachining to 100 μm by the Bosch process isolates each pixel thermally. Proximity effect transition edge sensors formed from Mo/Cu bilayers (Nucl. Instr. and Meth. A, these proceedings) are the temperature sensing elements for the bolometers. To read out such a large number of pixels, SCUBA-2 uses a superconducting quantum interference device readout for time domain multiplexing (Nucl. Instr. and Meth. A, these proceedings). The detector wafer is flip-chip bonded to the multiplexer wafer by indium bumps which provide electrical and thermal connections. The technologies that make SCUBA-2 possible have applications for large-format arrays from the submillimeter through the X-ray spectral regions.
Keywords :
Microfabrication , Bolometer array , Deep etching , Bump bonding