Title of article :
Backshort-Under-Grid arrays for infrared astronomy
Author/Authors :
Allen، نويسنده , , C.A and Benford، نويسنده , , D.J. and Chervenak، نويسنده , , J.A. and Chuss، نويسنده , , D.T. and Miller، نويسنده , , T.M. and Moseley، نويسنده , , S.H. and Staguhn، نويسنده , , J.G. and Wollack، نويسنده , , E.J.، نويسنده ,
Pages :
3
From page :
522
To page :
524
Abstract :
We are developing a kilopixel, filled bolometer array for space infrared astronomy. The array consists of three individual components, to be merged into a single, working unit; (1) a transition edge sensor bolometer array, operating in the milliKelvin regime, (2) a quarter-wave backshort grid, and (3) superconducting quantum interference device multiplexer readout. The detector array is designed as a filled, square grid of suspended, silicon bolometers with superconducting sensors. The backshort arrays are fabricated separately and will be positioned in the cavities created behind each detector during fabrication. The grids have a unique interlocking feature machined into the walls for positioning and mechanical stability. The spacing of the backshort beneath the detector grid can be set from ∼30–300 μm, by independently adjusting two process parameters during fabrication. The ultimate goal is to develop a large-format array architecture with background-limited sensitivity, suitable for a wide range of wavelengths and applications, to be directly bump bonded to a multiplexer circuit. We have produced prototype two-dimensional arrays having 8×8 detector elements. We present detector design, fabrication overview, and assembly technologies.
Keywords :
Backshort-Under-Grid , Transition edge sensor , Bolometer , Indium bump bonding , Large format arrays
Journal title :
Astroparticle Physics
Record number :
2028292
Link To Document :
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