Author/Authors :
Kِnig، نويسنده , , S. and Hِrmann، نويسنده , , Ch. and Horisberger، نويسنده , , R. and Streuli، نويسنده , , S. and Weber، نويسنده , , R.، نويسنده ,
Abstract :
For the barrel part of the CMS pixel tracker about 800 silicon pixel detector modules are required. The modules are bump bonded, assembled and tested at the Paul Scherrer Institute. This article describes the assembly procedure that will be used to build these modules.
