Author/Authors :
Alimonti، نويسنده , , G. and Andreazza، نويسنده , , A. and Bulgheroni، نويسنده , , A. and Corda، نويسنده , , G. and Di Gioia، نويسنده , , S. and Fiorello، نويسنده , , A. and Gemme، نويسنده , , C. and Koziel، نويسنده , , M. and Manca، نويسنده , , F. and Meroni، نويسنده , , C. and Nechaeva، نويسنده , , P. and Paoloni، نويسنده , , A. and Rossi، نويسنده , , L. and Rovani، نويسنده , , A. and Ruscino، نويسنده , , E.، نويسنده ,
Abstract :
The ATLAS collaboration is currently building 1500 pixel modules using the indium bump bonding technique developed by SELEX Sistemi Integrati (former AMS). The indium deposition and flip-chip process are described together with an overview of the chip stripping machine that allows defective modules to be reworked. The production is half-way through at the time of this writing. This paper also discusses the problems encountered during production and the adopted solutions.
