The concept of high angle wedge polishing and thickness monitoring in TEM sample preparation

The concept of high angle wedge polishing for TEM non-metal sample preparation is introduced for the first time. Also, introduced is the concept of converting lateral distance measurement into vertical thickness measurement in monitoring TEM sample thickness. Based on the Tripod polisher, Quadripod was constructed using these two concepts. Fast and reliable TEM sample preparation (mechanical polishing down to electron transparency) can be achieved using the Quadripod. In addition, Quadripod offers the ability of locating a specific area of interest.