Title of article :
Analysis of bending of cross sections of tensile tested electrodeposited copper foils
Author/Authors :
Yang، نويسنده , , Jeomshik and Lee، نويسنده , , Se-Hyeong and Nyung Lee، نويسنده , , Dong، نويسنده ,
Abstract :
The tensile strength of copper electrodeposits obtained from a copper sulfate bath decreased with increasing thickness. The microhardness of the deposit decreased with increasing distance from the interface between the deposit and the substrate. The results suggest a strength variation through the thickness which in turn gave rise to bending of the cross section of the tensile specimen during and after the tensile test. The radius of curvature of the bent cross section was analyzed, taking anisotropy of the deposits into account.
Keywords :
tensile test , Bending of cross section , Copper foil
Journal title :
Astroparticle Physics