• Title of article

    Time-dependent interfacial failure in metallic alloys

  • Author/Authors

    Pfaendtner، نويسنده , , J.A. and Muthiah، نويسنده , , R.C. and Liu، نويسنده , , C.T. and McMahon Jr، نويسنده , , C.J.، نويسنده ,

  • Pages
    11
  • From page
    1
  • To page
    11
  • Abstract
    Time-dependent intergranular brittle fracture has now been studied experimentally in a number of alloy systems, and the generic features are becoming clear. Mobile surface-adsorbed elements are caused to diffuse inward along grain boundaries under the influence of a tensile stress, and this can lead to sub-critical crack growth by decohesion. Oxygen is found to play this role in nickel-base superalloys and intermetallics, as well as in a precipitation-strengthened Cu–Be alloy. Crack-growth rates lie in the range 10−7–10−4 m sec−1. The same kind of cracking is found in steels treated so that free sulfur is able to segregate to the surface, as well as in Cu-Sn alloys, in which the embrittling element is surface-segregated Sn. The latter has been studied in bicrystals, and the importance of the variation in diffusivity with grain boundary structure has been documented. Hydrogen-induced cracking is a special case of an extremely mobile embrittling element and is responsible for much of the brittleness found in intermetallics. The effect of boron in retarding brittle behavior in Ni3Al has been shown to result partly from its interaction with hydrogen. This is a prime example of how segregated solutes can be used to ameliorate the tendency for diffusion-controlled brittle fracture.
  • Keywords
    Oxygen , Time-dependent intergranular brittle fracture , Metallic alloys , Crack-growth
  • Journal title
    Astroparticle Physics
  • Record number

    2054300