Author/Authors :
Martins، نويسنده , , R and Ferreira، نويسنده , , J and Gonçalves، نويسنده , , C and Nunes، نويسنده , , P and Fortunato، نويسنده , , J.I and Marvمo، نويسنده , , A.P. and Martins، نويسنده , , J.I، نويسنده ,
Abstract :
Results are presented on the electrical characteristics of power diodes soldered using new lead-free techniques based on Cu–Sn–Cu joints. Special emphasis is put on the role of the thickness of the Cu films electrodeposited on the electrical performances of the power diodes joined and to study the electrical stability of the joints formed, under extreme aggressive conditions.
Keywords :
Power diodes , soldering , Lead-free solders , Cu–Sn–Cu system , electrical parameters , Intermetallic phases
