Microstructural evolution, microhardness and thermal stability of HPT-processed Cu

Coarse-grained copper was subject to high-pressure torsion (HPT) and thermal treatment to study the effects of increasing amounts of deformation and subsequent annealing on the evolution of microstructure and microhardness. Cellular subgrains with low-angle grain boundaries were first formed at low strain. Some of the low-angle subgrain boundaries transformed to high-angle grain boundaries at higher strains, refining the average grain size from 200 μm to 150 nm. X-ray diffraction patterns showed the formation of crystallographic texture. Microhardness increased monotonically with increasing torsional strain. High internal stress and nonequilibrium grain boundaries were observed in unannealed samples. Annealing as-deformed samples at temperatures as low as 50°C decreased the microhardness, indicating a very low thermal stability of the deformation induced microstructures. Differential scanning calorimetry (DSC) revealed an exothermal peak between 180 and 280°C, caused by recrystallization. Annealing twins were also formed during recrystallization.